etl-m50d 半导体泵浦系列激光打标机 diode pump laser marker series

功能特点 dp半导体泵浦激光打标机使用国际上最先进的激光技术，采用进口半导体列阵，用波长808nm半导体激光二极管泵浦nd:yag介质，激光器体积小，是传统灯泵浦激光器的四分之一，光学系统采用全密封结构、具有光路预览和焦点指示功能、外形更美观、操作更方便；该机器配备最新的外置水冷系统，运行噪音极低，温度调节精度高，为机器长时间运作提供了可靠的保障。 激光器、电源、工作台一体化结构，打标效率高，金属打标效果好。 技术参数 平均激光功率：50w 激光波长：1064nm 光束质量：m2 ＜6 激光重复频率：≤30khz 标准雕刻范围：100mm×100mm 选配雕刻范围：50mm×50mm/150mm×150mm 雕刻深度：≤0.3mm 雕刻线速：≤7000mm/s 最小线宽：0.015mm 重复精度： ±0.003mm 整机功率：3kw 电力需求：220v/单相/50hz/15a 主机系统尺寸：880mm×950mm×(1040-1350)mm 冷却系统尺寸：650m×450mm×920mm

feature dp laser marking machine has the most advanced laser technology and adopted import semiconductor array the pump source.,with wave length 808nm semiconductor light emitting diode pump nd:yag medium. it volume is small .the volume is only the one fourth of the traditional dp laser marking machine .its optical system uses the entire seal structure and has the path of rays to look at in advance with the focal point instruction function. it has a beautiful appearance and the operation system is more convenient. this machine provides new outside water-cooling system. the movement noise is extremely low, it precision is very high. it has provided the most reliable safeguard. laser, power source, the work platform uses the integration structural design. the efficiency of marking is high and marking metal is better. parameter average laser-power: 50w wave-length: 1064nm beam quality: m2<6 recurrence rate: ≤khz engraving area: 100 ×100mm se-lect engraving area: 50mm ×50mm /100mm ×100mm engraving depth: ≤0.3mm engraving line speed: ≤7000mm/s min line width: 0.015mm repeat precision: ±0.003mm whole power: 3kw working voltage: 220v/single-phase/50hz/15a machine dimension: 880mm ×950mm ×(1040-1350)mm cooling system dimension: 650m ×450mm×920mm

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