广东高仕电研科技有限公司
广东高仕电研科技有限公司
PM-500SEG10是专门用于塞孔的绿色阻焊材料，适用于汽车板等要求较高PCB的塞孔工艺
PM-500 SEG10是专门用于塞孔的绿色阻焊材料，适用于汽车板等要求较高PCB的塞孔工艺。易塞孔，固化后无气泡、不开裂。重涂性好，面油不分层、高温不起泡。符合欧盟RoHS及低卤要求。
PM-500 SEG10green Solder Mask for plug hole, Applicable for AUTO PCB plug hole. Easy to plug hole, no bubble, no crack after curing. Good recoating, Good adhesion. Environmentally Friendly: RoHS, Halogen Free.
一、物性General properties
| 1 | 主剂Main agent | PM-500 SEG10 |
| 2 | 固化剂Hardener | H-50 HAS9 |
| 3 | 颜色Color | Green 绿色 |
| 4 | 主剂粘度 Main agent’s Viscosity (at 25℃) | 350±50dPa.s |
| 5 | 固化剂粘度 Hardener’s Viscosity (at 25℃) | 70±10dPa.s |
| 6 | 混合比例 Mixing ratio | 主剂Main agent：固化剂Hardener=7:3 |
| 7 | 混合后粘度 Viscosity after mixed (at 25℃) | 250±50dPa.s |
| 8 | 混合后固体含量Non-volatile % after mixed | 90±2% |
| 9 | 混合后比重Specific gravity after mixed | 1.4±0.05 |
| 10 | 保存期限Shelf life | 6个月/ 6 month after production |
| 11 | 包装规格Package | 1Kg/Cans（罐），10Kg/Box（箱） |
二、应用操作指引
| 基板表面处理 |
| 化学处理，浮石粉或火山灰处理，市水冲洗干净 |
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| 开油 |
| 主剂与固化剂按3：1混合，添加适量稀释剂，搅拌或震荡5-10分钟。 |
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| 静置 |
| 10-20分钟，使油墨充分排出开油时产生的气泡，但不超过24小时。 |
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| 塞孔印刷 |
| 专用铝片网或图形丝网，厚度18mm刮胶印刷。 清洁筛网避开其他油墨污染，室温20-25℃，湿度小于60%RH 印刷厚度要求湿膜在38-45um，干燥后25-30um。 |
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| 面油印刷 |
| 面印刷焊接面，第二面印刷零件面；36T或者43T网印刷。 清洁筛网避开其他油墨污染，室温20-25℃，湿度小于60%RH 印刷厚度要求湿膜在38-45um，干燥后25-30um。 |
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| 静置 |
| 20分钟以上，板材铜箔越厚，静置时间应越长，但不超过4个小时。 |
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| 预烤 |
| 两面分别印刷、分别烘烤 面热风循环烤箱：温度70-75℃，时间10-20分钟 第二面热风循环烤箱：温度70-75℃，时间15-30分钟 两面同时印刷、同时烘烤 热风循环烤箱：温度70-75℃，时间15-40分钟 |
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| 冷却叠板 |
| 放置20分钟以上使板材充分冷却，但停放时间不超过24小时。 叠板不易过多，叠板压力不超过40 mmHg |
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| 曝光 |
| 曝光能量一般在400-1000mj/cm2 ，使用21级曝光尺保持感度在10-12格之间 |
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| 静置 |
| 20分钟以上，但不超过24小时 |
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| 显像 |
| 压力2.0-2.5kg/cm2浓度1wt% Na2CO3，液温30±2℃，显像时间70-90秒 过显影缸后，再用2.5-3.0kg/cm2喷淋压力25℃左右的市水清洗45-60秒，使用2组以上海棉轮吸水，40℃以上热风吹干 |
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| 热固化 |
| 75℃×60分钟+100℃×30分钟+120℃×30分钟+150℃×60分钟 |
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| 丝印字符 |
| 丝网印刷设备及固化条件依字符油墨操作条件 |
Processing instructions
| Pre-treatment |
| Chemical treatment，Pumice scrub or Buff (over #1000) treatment Rinse with distilled water |
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| Mixing |
| Main agent and hardener agent in 7:3 mix, add appropriate thinner, shock 5-10 minutes |
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| Hold time |
| Hold time: within 20min after printing, But not more than 24 hours |
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| Plug hole |
| Aluminum mesh, 18mm plastic printing. Clean screen mesh to avoid other ink contamination. Room temperature: 20-25℃, Room humidity: under 60%RH. Printing wet film thickness requirements in more than 38-45 um, and above 25-30 um after drying. |
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| Coating |
| Screen printing by 36-43T polyester screen. |
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| Hold time |
| Hold time: within 20min after printing, But not more than 4 hours |
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| Pre-cure |
| First side: by hot air dryer at 70-75℃ for 10-20min Back side: by hot air dryer at 70-75℃ for 15-30min Both side: by hot air dryer at 70-75℃ for 15-40min |
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| Laminate mask film |
| Hold 12-30min to cool down enough Laminate mask film in vacuum under 40 mmHg |
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| Exposure |
| 400-1000mj/cm2 (on resist surface) to 10-12 level vacuum under 650 mmHg |
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| Hold time |
| Hold 20 min after exposure，But not more than 24hours |
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| Developing |
| By 2.0-2.5kg/cm2 Spraying of 1wt% Na2CO3 at 30±2℃ for 60-90sec Rinsing by 2.5-3.0kg/cm2 spraying of water at below 25℃ for 45-60sec Taking off rinsing water by sponge roll and drying by hot air at 40℃ for several minutes |
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| Post cure |
| 75℃*60min+100℃*30min+120℃*30min+150℃*60min |
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| Screen print Marking ink |
| Screen printing and curing condition depend upon marking specification |
三、Coating properties涂膜特性（IPC-SM-840E）
| 要求Requirement | 测试方法Test Method | 结果Result |
| 防霉性Nonnutrient | IPC-TM-650 2.6.1 | OK |
| 表面状况Visual Requirements | IPC-SM-840E 3.3.1 | OK |
| 铅笔硬度Pencil Hardness | ASTM D3363 | OK |
| 附着力（硬板）Adhesion of RPB | IPC-TM-650 2.4.28.1 | OK |
| 可加工性Mach inability | IPC-TM-650 2.4.7.1 | OK |
| 耐溶剂和清洗剂 Resistance to Solvents and Cleaning Agents | IPC-TM-650 2.3.42 涂膜无分离、裂纹、粘着 Coating shall not exhibit delamination, cracks, tackiness, swelling or permanent degradation | OK |
| 耐化学试剂 Resistance to Assembly Processes and Chemistry | IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃ 30min 10wt% NaOH 20℃ 30min | OK |
| 水解稳定性 Hydrolytic Stability | IPC-TM-650 2.6.11 | OK |
| 阻燃性Flammability | UL94 V0 E343546 | OK |
| 可焊性Solder ability | J-STD-003 260±5℃*10±1秒 | OK |
| 耐焊性 Resistance to Solder
| IPC-TM-650 2.6.8 Flux shall be a ROM0 or ROM1 per J-STD-004 助焊剂应依据J-STD-004，使用ROM0或ROM1 浮锡 Solder Float 260±5℃*10±1秒 | OK |
| Simulation of Lead Free Reflow 无铅回流焊模拟 | IPC-SM-840E 3.7.3.1 浮锡Solder Float 260±5℃*10±1秒*5次 | OK |
| 介电强度Dielectric Strength | IPC-TM-650 2.5.6.1 | 1000 V DC/mil |
| 绝缘电阻Insulation Resistance | IPC-TM-650 2.6.3.1 | ≧7.0×1012Ω |
| 耐湿绝缘电阻Moisture and Insulation Resistance | IPC-TM-650 2.6.3.1 | ≧5.0×108Ω |
| 电迁移Electrochemical Migration | IPC-TM-650 2.6.14 | OK |
| 冷热冲击Thermal Shock | IPC-TM-650 2.6.7.3 -65℃ to +125℃ *100 Cycles -65℃ 到 +125℃ *100次 | OK |
备注：此资料为本公司试验结果，不作为保证之用。适宜之条件，需参照技术资料，待贵公司实施确认后，再予以确定。
PS: This information is our test results, not as a guarantee. The suitable condition, need to consult technical data, to be your company carry out confirmation, to be determined.
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