产品应用
◆FPC激光切割机切割各种柔性线路板材料和覆盖膜，干净无炭化，包括常见的制造电路板的材料和制造元部件的材料；
◆可切割各种基底材料，如：硅片、陶瓷、玻璃等；
◆各种功能薄膜的精密刻蚀成型。
产品特点
◆高性能紫外激光器：采用高光束质量、高峰值功率、窄脉宽、高脉冲稳定度的进口10W/355nm全固态紫外激光器，
保证加工质量和稳定性；
◆优化设计的光学系统：保证超高的光束质量，减小功率损耗，减小聚焦光斑大小，确保紫外激光加工精度；
◆采用精密二维工作台和全闭环数控系统：保证机床的定位和重复精度；
◆采用位置传感器和CCD影像定位技术：激光基准点与机床基准点高精度重合；
◆采用高刚性设计、减振机床垫块和天然花岗岩组成的基座，消除工作台启动/停止和加速过程产生的惯性震动。
Product application
★Cutting a variety of flexible circuit board materials and mulch, clean and free of carbon, including common manufacturing circuit board materials and component parts manufacturing materials.
★Can cut a variety of substrate materials, such as silicon wafers, ceramics, glass etc.
★Precision etching various functional films
Product features
★High performance UV laser: uses the high beam quality, high peak power, short pulse width and high
pulse stability imported 10W/355nm, all-solid-state ultraviolet laser , ensure quality and stability
★Optimal design of optical systems: super high beam quality, reducing power consumption, reducing the
focal spot size to ensure that UV laser machining accuracy
★Using precision two-dimensional stage and full closed loop CNC system: ensure positioning and
repeat accuracy
★Using position sensor and CCD imaging location technology: laser beam datum points and Datum
point high precision of machine tools overlap
★Use highly rigid machine tool cushion blocks design, vibration reduction and natural granite base,
start/stop and speed up the process of the Elimination of worktable inertial vibration
