PM-500 WUA是专门为PCB客户开发的双组份特种UV固化字符油墨。该产品特别适合用于双面字符板，
在防焊显影成像后先印刷面字符，UV预干后，即可印刷第二面。第二面可采用传统热固字符油墨，
丝印后直接高温热固化；若使用本品，丝印后UV固化再加高温热固化。较传统UV字符比，此产品兼有
热固字符的白度高，附着力好，耐热及耐化学性能优良等特点。
PM-500 WUA is a two-component special UV curing character ink specially developed for PCB
customers.This product is especially suitable for double-sided character board. The first
character is printed after anti-welding imaging, and the second character can be printed
directly after UV predrying, and then into UV and high temperature curing.Compared with
traditional UV characters, this product has the advantages of high whiteness, good adhesion,
good heat and chemical resistance.
一、物性General properties
| 1 | 主剂Main agent | PM-500 WUA |
| 2 | 固化剂Hardener | H-50 WT80 |
| 3 | 颜色Color | white 白色 |
| 4 | 混合比例Mixing ratio | 主剂Main agent：固化剂Hardener=85：15 |
| 5 | 混合后粘度Viscosity after mixed (at 25℃) | 180±20dPa.s |
| 6 | 混合后固体含量Non-volatile % after mixed | 82±3% |
| 7 | 混合后比重Specific gravity after mixed | 1.3±0.1 |
| 8 | 黄变性color change (IR 270℃ /15um) | ∆E<1.5 |
| 9 | 保存期限Shelf life | 6个月/ 6 month after production |
| 10 | 包装规格Package | 1Kg/Cans（罐），10Kg/Box（箱） |
二、应用操作指引Processing instructions
| 阻焊层显影后线路板 |
| after development of the solder mask | ||
| ↓ |
| ↓ | ||
| 丝印PM-500 WUA |
| Printing PM-500 WUA | ||
| ↓ |
| ↓ | ||
| UV curing |
| UV curing | ||
| ↓ | ↓ |
| ↓ | ↓ |
| 丝印PM-500 WUA | 丝印TM-100 W01 |
| Printing PM-500 WUA | Printing TM-100 W01 |
| ↓ | ↓ |
| ↓ | ↓ |
| UV+热固化150℃*60min | 热固化150℃*60min |
| UV+Thermal curing 150℃*60min | 热固化150℃*60min |
备注：TM-100 W01为高仕公司传统热固字符油墨。
三、Coating properties涂膜特性（IPC-SM-840E）
| 要求Requirement | 测试方法Test Method | 结果Result |
| 防霉性Nonnutrient | IPC-TM-650 2.6.1 | OK |
| 表面状况Visual Requirements | IPC-SM-840E 3.3.1 | OK |
| 铅笔硬度Pencil Hardness | ASTM D3363 | OK |
| 附着力（硬板）Adhesion of RPB | IPC-TM-650 2.4.28.1 | OK |
| 可加工性Mach inability | IPC-TM-650 2.4.7.1 | OK |
| 耐溶剂和清洗剂 Resistance to Solvents and Cleaning Agents | IPC-TM-650 2.3.42 涂膜无分离、裂纹、粘着 Coating shall not exhibit delamination, cracks, tackiness, swelling or permanent degradation | OK |
| 耐化学试剂 Resistance to Assembly Processes and Chemistry | IPC-SM-840E 3.6.1.2 10vol% H2SO4 20℃ 30min 10wt% NaOH 20℃ 30min | OK |
| 水解稳定性 Hydrolytic Stability | IPC-TM-650 2.6.11 | OK |
| 阻燃性Flammability | UL94 V0 E343546 | OK |
| 耐焊性 Resistance to Solder
| IPC-TM-650 2.6.8 Flux shall be a ROM0 or ROM1 per J-STD-004 助焊剂应依据J-STD-004，使用ROM0或ROM1 浮锡 Solder Float 260±5℃*10±1秒 | OK |
| 介电强度Dielectric Strength | IPC-TM-650 2.5.6.1 | 1000 V DC/mil |
| 绝缘电阻Insulation Resistance | IPC-TM-650 2.6.3.1 | ≧7.0×1012Ω |
| 耐湿绝缘电阻Moisture and Insulation Resistance | IPC-TM-650 2.6.3.1 | ≧5.0×108Ω |
备注：此资料为本公司试验结果，不作为保证之用。适宜之条件，需参照技术资料，待贵公司实施确认后，再予以确定。
PS: This information is our test results, not as a guarantee. The suitable condition, need to consult technical data, to be your company carry out confirmation, to be determined
